全球領(lǐng)先的工藝表征解決方案提供商Rudolph Technologies日前宣布，收到來(lái)自臺(tái)灣晶圓廠的多套關(guān)于最新的Explorer檢測(cè)系統(tǒng)的訂單。訂單包括一套新系統(tǒng)，以及先前設(shè)備的升級(jí)系統(tǒng)。Explorer檢測(cè)設(shè)備專為CMP過(guò)程中的缺陷分析而設(shè)計(jì)。

Rudolph Technologies, Inc. , a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the receipt of multiple orders for its latest Explorer? Inspection Cluster from a major Taiwanese foundry. The orders include new systems as well as upgrades for previously installed equipment. The Explorer Cluster monitors defectivity in the Chemical Mechanical Polish (CMP) process module.

The Explorer System utilizes an AXi940? module to inspect the front side of the wafer using enhanced capabilities specifically designed to meet the unique challenges of CMP inspection in a foundry. In addition to helping users solve CMP process variation challenges, the AXi940 module has the ability to quickly and automatically create inspection recipes without sample wafers. The time required for recipe creation is of utmost concern to foundry customers due to the wide variety of devices that they manufacture.?

Scott Balak, Rudolph’s all-surface inspection product manager adds, “The Explorer System’s new waferless recipe creation capability was a key factor in this foundry’s purchase decision. With the Explorer Cluster creating recipes automatically, the customer benefits from both enhanced tool productivity as well as a more efficient use of their personnel and material.”

The Explorer Inspection Cluster is a modular approach to wafer inspection that may include one or more inspection modules for the wafer’s front, back or edge surfaces. Designed for maximum productivity and efficiency, the Explorer System incorporates up to four load ports using sophisticated queue management and features Discover? software, an inline defect analysis and data management system designed to seamlessly handle advanced macro defect inspection results. When the E30? (edge) and B30? (backside) inspection modules are paired with the AXi940 frontside module, correlation of defect data from all surfaces provides faster, more efficient response to defectivity issues.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.

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